What if the key to unlocking true circularity in smart packaging lay in swapping rigid plastics and metals for paper?

As global environmental regulations tighten, hardware designers and compliance teams face a tough challenge: How do we scale IoT, RFID, and NFC capabilities without expanding our e-waste footprint?
The answer is additive manufacturing and paper-based substrates.

By integrating flexible chip technologies, alternative conductive inks, and thin printed batteries directly onto paper, we can make sustainable electronics scalable—without sacrificing performance.

At Sustainable Electronics RESHAPED 2026 in Berlin, Victor Thenot from Tageos will walk through how their Innovation Center of Excellence is bringing these solutions to life.

What you'll learn in the talk:

• Concrete use cases for printed conductive interconnects & functional bridges
• Integrating thin, flexible printed batteries on paper
• Leveraging emerging flexible printed semiconductors (like Pragmatic’s NFC FlexIC) for paper-based inlays
• Balancing material selection, device architecture, and process design for performance & circularity

Event Details:

• Speaker: Victor Thenot from Tageos
• Topic: Printed Electronics Meets Paper: Scalable Paths to Sustainable RFID and NFC
• When: 20–21 Oct 2026
• Where: Estrel, Berlin (Sustainable Electronics RESHAPED 2026)

Check out the full program and register here.